DirectBOND
Direct Diode Laser System for Thermal Processing
Wavelength: 808 nm
Power: 30 W, 60 W
Features：
• Turn Key System
• 19” Rack-Mounted
• Air-Cooled
• Thermal Management
• Industrial Delivery Fiber
• Microprocessor Operation
• Serial, Analog and TT L Control
• Graphical User Interface
Applications：
Ideally Suited for High-Throughput Industrial Applications:
• FRIT Welding of OLED Displays
• Thermal Processing Tasks:
--Soldering
--Plastics Welding
Technical speci Fications
|
Output power, Fiber coupled
|
W |
30 |
60 |
|
Wavelength
|
nm |
808 |
| Linewidth, typical FWHM |
nm |
3 |
| Wavelength tolerance |
nm |
± 3 |
| Fiber size |
µm |
200 |
400 |
| Nnumerical aperture |
|
0.22 |
| Fiber Length, Other on request |
m |
3 |
| Fiber connector (out) |
|
SMA |
| Supply voltage |
V |
110 - 230 |
| Dimensions (L x W x H) |
mm
(inch) |
266 x 482 x 113
(10 x 19 x 5) |
| Humidity @ 25°c |
|
< 75% |
| Operating temperature range |
°C |
10 - 45 |
| Storage temperature |
°C |
5 - 50 |
| Cooling |
|
forced air |
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